Get inspired by Eminent Speakers

We’re hosting a technical seminar at Comet Group’s Lab One, and we’d like you to join us!
 
On Thursday, October 4th at 4:00 PM, Dr. Meyya Meyyappan from NASA will talk about “Electronics beyond Moore’s Law “, and Dr. Brian Toleno from Microsoft will talk about “Virtual and Augmented Reality – New Devices and New Challenges”.
 

If you’re curious about technology trends and new developments in electronics and augmented reality, these talks will prove to be very interesting.
 
In addition to these eminent speakers, you will also have the opportunity to network with peers and our technologists, and enjoy some good food, drink, and music.

Secure your spot by filling in the form below!

Attendance is limited.
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Food & Drinks

Parking Central Location

Why attend this event?

 
  • Learn from industry leaders
Dr. Meyyappan and Dr. Toleno will give their vision of the future, and challenge the way things are done today.
 
  • Meet technology leaders
Compare notes on shared challenges and solutions, in an informal setting.
 

Keynote Speakers

Dr. Meyya Meyyappan - Chief Scientist for Exploration, NASA
“Electronics beyond Moore’s Law”


Until June 2006, he served as the Director of the Center for Nanotechnology. He is a founding member of the Interagency Working Group on Nanotechnology (IWGN) established by the Office of Science and Technology Policy (OSTP). The IWGN is responsible for putting together the National Nanotechnology Initiative.

Dr. Meyyappan has authored or co-authored over 370 articles in peer-reviewed journals and made over 250 Invited/Keynote/Plenary Talks in nanotechnology subjects across the world and over 250 seminars at universities. His research interests include carbon nanotubes, graphene, and various inorganic nanowires, their growth and characterization, and application development in chemical and biosensors, instrumentation, electronics and optoelectronics.

Dr. Meyyappan is a Fellow of various institutes and has received numerous awards for his contributions and leadership in nanotechnology.

> Read the full biography
Dr. Brian J. Toleno - Director of Advanced Technology, Microsoft
"Virtual and Augmented Reality   New Devices and New Challenges"


Brian J. Toleno, Ph.D. is currently Director of New Technology at Microsoft working on mixed reality devices, in Mountain View, California. In this role Brian leads a team that does technology investigation and implementation for mixed reality devices. Previously, Brian was the Director of Global Product Management for Henkel Electronic Materials, LLC in Irvine, California where he managed the underfill and encapsluant business as well as the leader of the Global Technical Service team.

Brian obtained a Ph.D. in analytical chemistry from Penn State University, and his B.S. in chemistry from Ursinus College. Brian is an active member of and is also a frequent speaker and contributor to SMTA and IPC. Brian has written courses on underfill materials, Pb-free soldering, and failure analysis, and two chapters for electronic engineering handbooks on adhesives and materials.
Paul Smith - General Manager, Lab ONE

Paul Smith has been the General Manager of Lab One and the Senior Vice President of Product Marketing for Comet PCT since September 2011.

Prior to joining Comet, Paul held a variety of executive, managerial, individual contributor, and engineering roles within various semiconductor product groups at Applied Materials in the areas of product management, marketing, program management, and product technical support. During his 22 years at Applied Materials, he made various contributions to the evolution of semiconductor technology and was granted over a dozen U.S. patents. During his last few years at Applied Materials, he focused on reliability and performance of critical process power subsystems.

Before joining Applied Materials, Paul spent five years with Siemens Components, Inc. as a Process Development and Integration Engineer.

He earned his Bachelor of Science in Physics, Chemistry, and Mathematics from Illinois State University.

Moderator

Trevor Galbraith - Editor-in-Chief, Global SMT & Packaging
 
Trevor Galbraith started in academic publishing with Wela Publications Ltd, publishers of Circuit World, Soldering & Surface Mount Technology and Microelectronics International.
 
In 1997, the journal titles were acquired by MCB University Press, where Trevor worked as an Associate Editor. In December 1999 Trevor established Trafalgar Publications Ltd and launched the magazine Global SMT & Packaging to address the globalization of the electronics manufacturing industry and the convergence of electronics assembly with backend packaging technologies.
 
Trevor has developed Global SMT & Packaging over the past 17 years to become the leading international technical magazine in the world with a global readership in excess of 180,000 readers